Semiconductor package device and method of manufacturing the same

ABSTRACT

In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No. 15/807,266 filed Nov. 8, 2017, the contents of which is incorporated herein by reference in its entirety.

BACKGROUND 1. Technical Field

The present disclosure relates generally to a semiconductor package device and a method of manufacturing the same, and to a semiconductor package device including a stacking structure and a method of manufacturing the same.

2. Description of the Related Art

In a stacked semiconductor package device (which may include an upper substrate, a lower substrate and an interposer), an underfill can be applied around electrical contacts for protection. However, due to hydrophilicity of the substrate corresponding to the underfill (e.g. the substrate or a substance on the substrate may exert an attractive force on the underfill), the underfill may bleed out or overflow to cover other electrical contacts, which can have an impact on the electrical characteristic of the semiconductor package device. In addition, the overflowing underfill may occupy a space which is supposed to accommodate other components on the substrate, and thus an extra space may be provided, which can increase a size of the semiconductor package device.

SUMMARY

In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element, and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.

In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace, and a non-filling region separated from the filling region. The structure is disposed over the substrate and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region. At least a portion of the barrier element protrudes beyond a surface of the structure facing the first surface of the substrate.

In one or more embodiments, a method of manufacturing a semiconductor package device includes (a) providing a substrate having a first surface, the first surface including a filling region, the substrate including a trace disposed on the first surface adjacent to the filling region, and a pad disposed on the filling region; (b) depositing a soldering material on the trace and the pad in a common operation to form a barrier element on the trace and an electrical contact on the pad; (c) disposing a structure over the filling region, the structure electrically connected to the substrate; and (d) applying an underfill to the filling region.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a cross-sectional view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 1B illustrates a top view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 1C illustrates a top view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 1D illustrates a perspective view of a trace in accordance with some embodiments of the present disclosure.

FIG. 1E illustrates a perspective view of a trace in accordance with some embodiments of the present disclosure.

FIG. 1F illustrates a top view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 2A illustrates a cross-sectional view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 2B illustrates an enlarged view of a portion of the semiconductor package device shown in FIG. 2A in accordance with some embodiments of the present disclosure.

FIG. 2C illustrates a bottom view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 2D illustrates a bottom view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 2E illustrates a bottom view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 2F illustrates a bottom view of a semiconductor package device in accordance with some embodiments of the present disclosure.

FIG. 2G illustrates a top view of a trace in accordance with some embodiments of the present disclosure.

FIG. 2H illustrates a top view of a trace in accordance with some embodiments of the present disclosure.

FIG. 3A illustrates a comparative semiconductor package device.

FIG. 3B illustrates a comparative semiconductor package device.

FIG. 3C illustrates a comparative semiconductor package device.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4E′, FIG. 4F and FIG. 5 illustrate a method of manufacturing a semiconductor package in accordance with some embodiments of the present disclosure.

Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar elements. The present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

DETAILED DESCRIPTION

FIG. 1A illustrates a cross-sectional view of a semiconductor package device 1 in accordance with some embodiments of the present disclosure. The semiconductor package device 1 includes a substrate 10, an electronic component 11, a barrier element 12 and an underfill 13.

The substrate 10 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. The substrate 10 may include an interconnection structure, such as a redistribution layer (RDL). The substrate 10 can have a surface 101 and a surface 102 opposite to the first surface 101. In some embodiments, the surface 101 of the substrate 10 is referred to as a top surface or a first surface and the surface 102 of the substrate 10 is referred to as a bottom surface or a second surface.

The electronic component 11 is disposed on the top surface 101 of the substrate 10 and electrically connected to the substrate 10. The electronic component 11 may include a chip or a die including a semiconductor substrate, one or more integrated circuit devices and/or one or more overlying interconnection structures therein. The integrated circuit devices may include active devices such as transistors and/or passive devices such resistors, capacitors, inductors, or a combination thereof. In some embodiments, the electronic component 11 is electrically connected to the substrate 10 through one or more electrical contacts 11 c (e.g., solder balls) by a flip-chip technique.

The underfill 13 may be disposed on the top surface 101 of the substrate 10 to cover an active surface of the electronic component 11 and the electrical contacts 11 c. In some embodiments, the underfill 13 includes an epoxy resin, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof. In some embodiments, the underfill 13 may be a capillary underfill (CUF) or a molded underfill (MUF) depending on design specifications. A portion of the top surface 101 of the substrate 10 that is covered by the underfill 13 may be referred to herein as a filling region.

The barrier element 12 is disposed on a trace 10 t disposed on or adjacent to the top surface 101 of the substrate 10. In some embodiments, the trace 10 t surrounds the underfill 13 or the filling region. In some embodiments, the barrier element 12 may be or may include solder or other suitable materials which may be conductive. In some embodiments, a contact angle defined by a material of the barrier element 12 and a material of the underfill 13 is equal to or greater than about 25 degrees (e.g. is equal to or greater than about 27 degrees, is equal to or greater than about 29 degrees, is equal to or greater than about 31 degrees, or greater). In some implementations, the barrier element 12 can be omitted. However, due to the hydrophilicity of the substrate 10 corresponding to the underfill 13, the underfill 13 may bleed out to cover other electrical contacts or to occupy a space that is supposed to accommodate other components on the substrate 10. In accordance with the embodiments shown in FIG. 1 of the present disclosure, by forming the barrier element 12 (e.g., a solder dam) to surround the filing region or the underfill 13, the bleeding out issue can be avoided. In addition, the barrier element 12 can be formed when forming the electrical contacts 11 c. In other words, the barrier element 12 and the electrical contacts 11 c can be formed in a common process using a same material (e.g., a process including printing solder), and thus an additional process can be omitted, which can reduce a manufacturing cost. In other embodiments, the electronic component 11 may be electrically connected to the substrate 10 through pillars including copper, a copper alloy, or another metal, and the barrier element 12 can be formed when forming electrical contacts of other elements (such as passive elements or active elements).

FIG. 1B and FIG. 1C illustrate top views of the semiconductor package device 1 shown in FIG. 1A in accordance with some embodiments of the present disclosure. As shown in FIG. 1B and FIG. 1C, the trace 10 t includes a first portion 10 t 1 and a second portion 10 t 2. During the process for forming the underfill 13, the underfill 13 is injected or otherwise applied at a predetermined location (e.g., an injection region) on the top surface 101 of the substrate 10, and thus an amount of the underfill 13 at the injection region is more than that at another region. To avoid the bleeding out of the underfill 13, a width of the trace 10 t at the injection region can be set to be greater than a width of the trace 10 t at the other region. As shown in FIG. 1B, for example, the injection region may be located at or adjacent to the first portion 10 t 1 of the trace 10 t, and a width of the first portion 10 t 1 of the trace 10 t is greater than a width of the second portion 10 t 2 of the trace 10 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, a height of the barrier element 12 on the first portion 10 t 1 of the trace 10 t is greater than a height of the barrier element 12 on the second portion 10 t 2 of the trace 10 t (e.g. the barrier element 12 has a non-uniform height), for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, a height of the underfill 13 adjacent to the first portion 10 t 1 of the trace 10 t is greater than a height of the underfill 13 adjacent to the second portion 10 t 2 of the trace 10 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, the trace 10 t is substantially ring-shaped.

FIG. 1D illustrates a perspective view of the trace 10 t before a reflow process and FIG. 1E illustrates a perspective view of the trace 10 t and the barrier element 12 after the reflow process in accordance with some embodiments of the present disclosure. As shown in FIG. 1D, a width of the first portion 10 t 1 of the trace 10 t is greater than a width of the second portion 10 t 2 of the trace 10 t, and the height of the barrier element 12 on the first portion 10 t 1 of the trace 10 t is substantially the same as the height of the barrier element 12 on the second portion 10 t 2 of the trace 10 t. After the reflow process, as shown in FIG. 1E, the height of the barrier element 12 on the first portion 10 t 1 of the trace 10 t is greater than the height of the barrier element 12 on the second portion 10 t 2 of the trace 10 t.

FIG. 1F illustrates a top view of the semiconductor package device 1 shown in FIG. 1A in accordance with some embodiments of the present disclosure. In general, stress usually occurs at corners of the electronic component 11, while a middle portion of each edge of the electronic component 11 suffers a relatively low stress. Therefore, to reduce the manufacturing cost, the underfill 13 and the trace 10 t on which the barrier element 12 is disposed may be selectively formed at the corners of the electronic component 11 as shown in FIG. 1F, and forming the underfill 13 and the trace 10 t at or near the middle portion of the edges of the electronic component 11 may be omitted (e.g. structures each including an underfill 13 and a trace 10 t may be respectively disposed at the corners of the electronic component 11 and may be spaced apart).

FIG. 2A illustrates a cross-sectional view of a semiconductor package device 2 in accordance with some embodiments of the present disclosure. The semiconductor package device 2 includes a substrate 20, an electronic component 21 a, an electronic component 21 b, a package body 22, an interposer 23, an underfill 24 and a barrier element 25.

The substrate 20 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. The substrate 20 may include an interconnection structure, such as an RDL. The substrate 20 can have a surface 201 and a surface 202 opposite to the first surface 201. The surface 201 of the substrate 20 may be referred to herein as a top surface or a first surface and the surface 202 of the substrate 20 may be referred to herein as a bottom surface or a second surface.

The electrical components 21 a, 22 b are disposed on the top surface 201 of the substrate 20. The electrical component 21 a may include an active component, such as an integrated circuit (IC) chip or a die. The electrical component 21 b may include a passive electrical component, such as a capacitor, a resistor or an inductor. Each electrical component 21 a, 21 b may be electrically connected to one or more of another electrical component 21 a, 21 b or to the substrate 20 (e.g., to the RDL of the substrate 20), and electrical connection may be attained by way of flip-chip or wire-bond techniques.

The package body 22 is disposed on the top surface 201 of the substrate 20 and covers the electronic components 21 a and 21 b. In some embodiments, the package body 22 includes, for example, organic materials (e.g., a molding compound, bismaleimide triazine (BT), a polyimide (PI), polybenzoxazole (PBO), a solder resist, an Ajinomoto build-up film (ABF), a polypropylene (PP) or an epoxy-based material), inorganic materials (e.g., silicon, a glass, a ceramic or a quartz), liquid-film materials and/or dry-film materials, or a combination thereof.

The interposer 23 is disposed over the bottom surface 202 of the substrate 20 and electrically connected to the substrate 20 through one or more electrical contacts 20 c (e.g., solder balls). The interposer 23 may include at least one interconnection in the form of a through via 23 v penetrating the interposer 23 for electrical connection (e.g. to one or more external devices). Exposed traces (e.g. a trace 20 t) and/or conductive pads on the bottom surface 202 of the substrate 20 can be electrically connected to the through via 23 v of the interposer 23 through the electrical contacts 20 c. The interposer 23 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. The interposer 23 and the electrical contacts 20 c may be arranged at or near a periphery of the bottom surface 202 of the substrate 20. In some embodiments, the interposer 23 defines a cavity 23 c that exposes a portion of the bottom surface 202 of the substrate, a portion of the underfill 24 and the barrier element 25. In some embodiments, the barrier element 25 may protrude beyond a surface of the interposer 23.

The underfill 24 may be disposed between the bottom surface 202 of the substrate 20 and the interposer 23 to cover the electrical contacts 20 c. In some embodiments, the underfill 24 includes an epoxy resin, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof. In some embodiments, the underfill 23 may be a CUF or a MUF depending on design specifications. A portion of the bottom surface 202 of the substrate 20 that is covered by the underfill 24 may be referred to herein as a filling region.

The barrier element 25 is disposed on the trace 20 t on the bottom surface 202 of the substrate 20 as shown in FIG. 2B, which illustrates an enlarged view of a portion of the semiconductor package device 2 shown in FIG. 2A in accordance with some embodiments of the present disclosure. In some embodiments, the barrier element 25 may be or include solder or other suitable materials which may be conductive. In some embodiments, a contact angle defined by a material of the barrier element 25 and a material of the underfill 24 is equal to or greater than about 25 degrees (e.g. is equal to or greater than about 27 degrees, is equal to or greater than about 29 degrees, is equal to or greater than about 31 degrees, or greater). In some embodiments, the barrier element 25 can be omitted. However, due to the hydrophilicity of the substrate 20 corresponding to the underfill 24, the underfill 24 may bleed out to cover other electrical contacts or to occupy a space that is supposed to accommodate other components on the substrate 20. In accordance with the embodiments shown in FIG. 2A of the present disclosure, by forming the barrier element 25 (e.g., a solder dam) to block the underfill 24, the underfill 24 can be prevented from flowing to a portion of the bottom surface 202 of the substrate 20 that is exposed by the cavity 23 c of the interposer 23. Therefore, the cavity 23 c of the interposer 23 can have sufficient space to accommodate additional electronic components.

FIG. 2C illustrates a bottom view of the semiconductor package device 2 shown in FIG. 2A in accordance with some embodiments of the present disclosure. As shown in FIG. 2C, the trace 20 t, on which the barrier element 25 is disposed, is disposed on the bottom surface 202 of the substrate 20 to prevent the underfill 24 from flowing to the portion of the bottom surface 202 of the substrate 20 that is exposed by the cavity 23 c of the interposer 23. As shown in FIG. 2C, the trace 20 t surrounds a portion of the bottom surface 202 of the substrate 20 that is exposed from the interposer 23. For example, the trace 20 t is disposed on four edges of the exposed portion of the bottom surface 202 of the substrate 20. In some embodiments, the trace 20 t may be selectively disposed on one, two or three edges of the exposed portion of the bottom surface 202 of the substrate 20. For example, the trace 20 t may be disposed on two opposing edges of the bottom surface 202 of the substrate 20. For example, the trace 20 t may be disposed on two adjacent edges of the bottom surface 202 of the substrate 20 (e.g., in an L-shape arrangement). For example, the trace 20 t may be disposed on three adjacent edges of the bottom surface 202 of the substrate 20 (e.g., in a U-shape arrangement).

FIG. 2D and FIG. 2E illustrate bottom views of the semiconductor package device 2 shown in FIG. 2A in accordance with some embodiments of the present disclosure. The structure shown in FIG. 2D or 2E is similar to that shown in FIG. 2C, except that in FIG. 2C, a width of the trace 20 t is substantially uniform while in FIG. 2D or 2E, a width of the trace 20 t is non-uniform.

As shown in FIG. 2D and FIG. 2E, the trace 20 t includes a first portion 20 t 1 and a second portion 20 t 2. During the process for forming the underfill 24, the underfill 24 is injected at a predetermined location (e.g., an injection region) on the bottom surface 202 of the substrate 20, and an amount of the underfill 24 at the injection region is more than that at other region. To avoid the bleeding out of the underfill 24, a width of the trace 20 t at, near or adjacent to the injection region can be set to be greater than a width of the trace 20 t at the other region. For example, as shown in FIG. 2D or 2E, the injection region may be located at or adjacent to the first portion 20 t 1 of the trace 20 t, and a width of the first portion 20 t 1 of the trace 20 t is greater than a width of the second portion 20 t 2 of the trace 20 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, a height of the barrier element 25 on the first portion 20 t 1 of the trace 20 t is greater than a height of the barrier element 25 on the second portion 20 t 2 of the trace 20 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, a height of the underfill 24 adjacent to the first portion 20 t 1 of the trace 20 t is greater than a height of the underfill 24 adjacent to the second portion 20 t 2 of the trace 20 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, the trace 20 t is substantially ring-shaped. In some embodiments, the trace 20 t is similar to the trace 10 t shown in FIG. 1D and FIG. 1E.

FIG. 2F illustrates a bottom view of the semiconductor package device 2 shown in FIG. 2A in accordance with some embodiments of the present disclosure. In general, stress usually occurs at corners of the substrate 20 while a middle portion of each edge of the substrate 20 suffers a relatively low stress. Therefore, to reduce manufacturing cost, the underfill 24 and the trace 20 t on which the barrier element is disposed can be selectively formed at the corners of the substrate 20 as shown in FIG. 2F, and forming the underfill 24 and the trace 20 t at or near the middle portion of the edges of the substrate 20 may be omitted (e.g. structures each including an underfill 23 and at least a portion of a trace 20 t may be respectively disposed at the corners of the substrate 20 and may be spaced apart). As shown in FIG. 2F, the trace 20 t includes a first portion 20 t 1 exposed from the interposer 23 and a second portion 20 t 2 disposed between the substrate 20 and the interposer 23. In some embodiments, at least a portion of the second portion 20 t 2 of the trace 20 t is exposed from the interposer 23. In some embodiments, a width of the first portion 20 t 1 of the trace 20 t is greater than a width of the second portion 20 t 2 of the trace 20 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, a height of the barrier element 25 on the first portion 20 t 1 of the trace 20 t is greater than a height of the barrier element 25 on the second portion 20 t 2 of the trace 20 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater. In some embodiments, a height of the underfill 24 adjacent to the first portion 20 t 1 of the trace 20 t is greater than a height of the underfill 24 adjacent to the second portion 20 t 2 of the trace 20 t, for example, at least about 1.1 times greater, at least about 1.2 times greater, or at least about 1.3 times greater.

In some embodiments, as shown in FIG. 2G and FIG. 2H, the trace 20 t may include multiple sections, and each section is separated from another section. The number of the sections can be determined depending on design specifications.

FIG. 3A illustrates a comparative the semiconductor package device. The structure shown in FIG. 3A is similar to that shown in FIG. 2B, except that in FIG. 3A, the electrical contacts 20 c and the underfill 24 shown in FIG. 2B are replaced by an anisotropic conductive film (ACF) 34. The ACF 34 is applied or disposed between the substrate 20 and the interposer 23 to provide electrical connections therebetween. Unlike the underfill 24, the ACF 34 may avoid the bleeding out issue. However, the ACF 34 has a relatively high resistance and cost compared to solder balls (e.g., electrical contacts 20 c). In addition, the ACF 34 is formed by applying heat and pressure, which may damage the semiconductor package device if the pressure or the heat is not well-controlled.

FIG. 3B illustrates a comparative semiconductor package device. The structure shown in FIG. 3B is similar to that shown in FIG. 2B, except that in FIG. 3B, the barrier element 25 is omitted. As shown in FIG. 3B, to prevent the bleeding out issue, a recess 20 r is formed on the bottom surface 202 of the substrate 20 to accommodate the overflowed underfill 24. However, the depth and the width of the recess 20 r may be large to accommodate the overflowed underfill 24, which can hinder the miniaturization of the semiconductor package device. In addition, the underfill 24 has a high hydrophilicity (and, for example, a contact angle of less than 25 about degrees) relative to the substrate 20 or solder resist on the substrate 20, and thus using the recess 20 r to avoid the bleeding out issue is not always effective.

FIG. 3C illustrates a comparative semiconductor package device. The structure shown in FIG. 3C is similar to that shown in FIG. 3B, except that in FIG. 3C, the bottom surface 202 of the substrate 20 further includes a protruding portion 20 p to block the overflowed underfill 24. The structure shown in FIG. 3C can be more effective at avoiding the bleeding out issue compared with the structure shown in FIG. 3B. However, it can be challenging to implement a sufficiently high protruding portion 20 p of the substrate 20 or solder resist of the substrate 20.

In accordance with the embodiments shown in FIG. 2B, the barrier element 25 may include solder. Because the hydrophilicity of the underfill 24 relative to solder is relatively low (and the contact angle is equal to or greater than about 25 degrees (e.g. is equal to or greater than about 27 degrees, is equal to or greater than about 29 degrees, is equal to or greater than about 31 degrees, or greater)), the underfill 24 is less prone to overflow beyond the barrier element 25. In addition, the barrier element 25 can be formed when forming the electrical contacts 20 c. In other words, the barrier element 25 and the electrical contacts 20 c can be formed in a common process (e.g., by printing solder), and thus an additional process can be omitted, which can reduce the manufacturing cost.

FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, and FIG. 4F are cross-sectional views of a semiconductor structure at various stages of fabrication, and FIG. 4E′ is a bottom view of such a semiconductor structure, in accordance with some embodiments of the present disclosure. Various figures have been simplified to better highlight aspects of the present disclosure.

Referring to FIG. 4A a substrate strip including multiple substrates 40 is provided, and the provision of the multiple substrates 40 allows multiple semiconductor package devices to be manufactured concurrently. The substrate 40 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate.

An electronic component 41 a and an electronic component 41 b are formed or disposed on a top surface 401 of the substrate 40 and electrically connected to the substrate 40 by, for example, flip-chip, wire-bond or surface-mount-technology (SMT). Each of the electronic components 41 a, 41 b includes a plurality of semiconductor devices, such as, but not limited to, transistors, capacitors and resistors interconnected together by a die interconnection structure into functional circuits to thereby form an integrated circuit. A device side of the semiconductor die includes an active portion including integrated circuitry and interconnections.

A trace 10 and one or more pads 46 may be disposed on a bottom surface 402 of the substrate 40. The trace 10 may be disposed adjacent to a filling region of the bottom surface 402, and the one or more pads 46 may be disposed in the filling region of the bottom surface 402.

Referring to FIG. 4B, a package body 42 is formed on the top surface 401 of the substrate 40 and encapsulates a portion of the top surface 401 of the substrate 40 and the electronic components 41 a and 41 b. In some embodiments, the package body 42 includes, for example, organic materials (e.g., a molding compound, BT, a PI, PBO, a solder resist, an ABF, a PP or an epoxy-based material), inorganic materials (e.g., silicon, a glass, a ceramic or a quartz), liquid-film materials and/or dry-film materials, or a combination thereof. The package body 42 may be formed by a molding technique, such as transfer molding or compression molding.

Referring to FIG. 4C, the structure shown in FIG. 4B is flipped, and a solder paste is printed at predetermined locations to form solder balls 40 c (e.g. on the one or more pads 46) and a barrier element 45 (e.g. on the trace 10). In some embodiments, the barrier element 45 and the trace 10 on which the barrier element 45 is disposed are the same as or similar to any of those shown in FIG. 2C through FIG. 2H depending on design specifications.

Referring to FIG. 4D, an interposer 43 is mounted on the bottom surface 402 of the substrate 40 and electrically connected to the substrate 40 through the solder balls 40 c. The interposer 43 may include at least one through via 43 v penetrating the interposer 43 for electrical connection. The interposer 43 may include, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass-fiber-based copper foil laminate. The interposer 43 and the electrical contacts 40 c may be arranged at or near a periphery of the bottom surface 402 of the substrate 40. In some embodiments, the interposer 43 defines a cavity 43 c that exposes a portion of the bottom surface 402 of the substrate and the barrier element 45. A reflow process is then carried out.

Referring to FIG. 4E, an underfill 44 may be formed or disposed in a gap between the bottom surface 402 of the substrate 40 and the interposer 43 to cover the electrical contacts 40 c. In some embodiments, the underfill 44 includes an epoxy resin, a molding compound (e.g., an epoxy molding compound or other molding compound), a polyimide, a phenolic compound or material, a material including a silicone dispersed therein, or a combination thereof. In some embodiments, the underfill 43 may be a CUF or a MUF depending on design specifications.

In some embodiments, the underfill 44 is injected or applied at a predetermined location (e.g., an injection region) on the bottom surface 402 of the substrate 40, and thus an amount of the underfill 44 at the injection region is more than that at another region. To avoid the bleeding out of the underfill 44, a height of the barrier element 45 on the injection region is greater than a height of the barrier element 45 on the other region. In some embodiments, a height of the underfill 44 adjacent to the injection portion is higher than a height of the underfill 44 adjacent to the other portion.

FIG. 4E′ illustrates a bottom view of the operation for forming underfill 44 as shown in FIG. 4E in accordance with some embodiments of the present disclosure. As shown in FIG. 4E′, the underfill 44 is injected or applied at the predetermined location (e.g., the injection region) on the bottom surface 402 of the substrate 40. The substrate 40 may define one or more cutting channels 49 c.

Referring to FIG. 4F, singulation may be performed to separate out individual semiconductor package devices 4. That is, the singulation is performed through the interposer 43, the substrate strip including the substrates 40 and the package body 42. In some embodiments, the singulation may be performed along the cutting channel 49 c shown in FIG. 4E′. The singulation may be performed, for example, by using a dicing saw, laser or other appropriate cutting technique. In some embodiments, the semiconductor package device 4 is the same as the semiconductor package device 2 shown in FIG. 2A.

FIG. 5 illustrates a bottom view of the operation for forming underfill 24 as shown in FIG. 2F in accordance with some embodiments of the present disclosure. As shown in FIG. 5, an underfill 54 is injected or applied at a predetermined location (e.g., an injection region) on the bottom surface of the substrate. Then, singulation may be performed along a cutting channel 59 c.

As used herein, the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be deemed to be “substantially” the same if a difference between the values is less than or equal to ±10% of an average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, “substantially” parallel can refer to a range of angular variation relative to 0° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “substantially” perpendicular can refer to a range of angular variation relative to 90° that is less than or equal to ±10°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.

As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 10⁴ S/m, such as at least 10⁵ S/m or at least 10⁶ S/m. The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

As used herein, the singular terms “a,” “an,” and “the” may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided “on” or “over” another component can encompass cases where the former component is directly on (e.g., in physical contact with) the latter component, as well as cases where one or more intervening components are located between the former component and the latter component.

While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It can be clearly understood by those skilled in the art that various changes may be made, and equivalent components may be substituted within the embodiments without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus, due to variables in manufacturing processes and such. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it can be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure. 

What is claimed is:
 1. A semiconductor package device, comprising: a substrate having a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface; an interposer disposed on the second surface of the substrate; and an underfill disposed between the substrate and the interposer and exposing a portion of the second surface of the substrate, wherein a lateral surface of the interposer, a lateral surface of the underfill and the lateral surface of the substrate are substantially coplanar.
 2. The semiconductor package device of claim 1, wherein the interposer defines a cavity, wherein the exposed portion of the second surface of the substrate is exposed from the cavity of the interposer.
 3. The semiconductor package device of claim 1, further comprising a barrier element disposed between the underfill and the exposed portion of the second surface, wherein the barrier element is configured to constrain the underfill.
 4. The semiconductor package device of claim 3, wherein the greatest height of the barrier element measured from the second surface of the substrate is greater than the shortest distance between the interposer and the second surface of the substrate.
 5. The semiconductor package device of claim 3, wherein the substrate includes a trace disposed adjacent to the second surface of the substrate, and the barrier element is disposed on the trace.
 6. The semiconductor package device of claim 3, wherein a portion of the barrier element is located between the interposer and the substrate.
 7. The semiconductor package device of claim 1, wherein the exposed portion of the second surface of the substrate is exposed to air.
 8. The semiconductor package device of claim 1, further comprising: a first electronic component disposed on the first surface of the substrate.
 9. The semiconductor package device of claim 8, further comprising: a package body disposed on the first surface of the substrate and encapsulates the first electronic component.
 10. The semiconductor package device of claim 8, wherein a thickness of the first electronic component is smaller than a thickness of the interposer.
 11. The semiconductor package device of claim 1, wherein the underfill includes an anisotropic conductive film.
 12. The semiconductor package device of claim 1, further comprising: a second electronic component disposed on the second surface of the substrate, wherein the interposer and the underfill define a cavity accommodating the second electronic component.
 13. A semiconductor package device, comprising a substrate having a first surface; an electronic component disposed on the first surface of the substrate, the electronic component including a first lateral surface and a second lateral surface adjacent to the first lateral surface; a trace disposed on the first surface of the substrate; a barrier element disposed on the trace, the barrier element along with the first lateral surface of the electronic component; and an underfill disposed on the first surface of the substrate and in contact with the electronic component and the barrier element.
 14. The semiconductor package device of claim 13, wherein the barrier element also is adjacent to the second lateral surface of the electronic component.
 15. The semiconductor package device of claim 13, wherein the barrier element includes a plurality of portions, and each portion of the plurality of portions is disposed spaced apart from the adjacent portions.
 16. The semiconductor package device of claim 13, wherein the barrier element includes a ring-shaped structure.
 17. The semiconductor package device of claim 13, wherein the barrier element includes a plurality of ring portions, and each ring portion of the plurality of ring portions overlaps the electronic component.
 18. A method of manufacturing a semiconductor package device, the method comprising: providing a substrate strip having a first surface and a second surface opposite to the first surface, and a barrier element disposed on the first surface of the substrate strip; disposing a structure on the first surface of the substrate strip, wherein the structure is spaced apart from the substrate strip by a gap; filling an protection material in the gap; dividing the substrate strip, the protection material and the structure into multiple semiconductor package devices.
 19. The method of claim 18, further comprising: forming a package body on the second surface of the substrate strip to encapsulate the second surface of the substrate.
 20. The method of claim 18, further comprising: disposing an electronic component in a cavity defined by the first surface of the substrate strip, the structure and the protection material. 